As an Assembly Equipment Engineer Intern, you will enhance NSOP detection in the Wire Bond process, improve alarm capabilities, collaborate with engineers, and analyze data to reduce downtime.
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Project Title:
Improvement of NSOP (Non-Stick On Pad) Alarm for WB Process Early Detection
Description:
Enhance NSOP (Non-Stick On Pad) detection and alarm capability in the Wire Bond (WB) process to enable early identification of bond stick failure, reduce unscheduled downtime, and prevent extended production impact due to delayed NSOP response.
Scope:
Supporting Team:
Deliverables:
Stretch Goal:
Requirement:
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Project Title:
Improvement of NSOP (Non-Stick On Pad) Alarm for WB Process Early Detection
Description:
Enhance NSOP (Non-Stick On Pad) detection and alarm capability in the Wire Bond (WB) process to enable early identification of bond stick failure, reduce unscheduled downtime, and prevent extended production impact due to delayed NSOP response.
Scope:
- Define and standardize NSOP (Non-Stick On Pad) failure criteria in WB process
- Improve NSOP alarm logic for early detection before mass failure occurs
- Collaborate with EE and Manufacturing Engineers to align alarm thresholds with actual bonding behavior
- Execute UAT and pilot run on selected WB machines after alarm enhancement
- Collect NSOP event data for downtime, frequency, and failure trend analysis
Supporting Team:
- Equipment Engineering (EE) Team
- Manufacturing Engineering Team
- Process Engineering Team
- Automation / System Team (if alarm data integration is required)
Deliverables:
- Clearly defined NSOP (Non-Stick On Pad) detection criteria for WB process
- Improved or new NSOP alarm with early warning capability
- Reduction in unscheduled downtime caused by delayed NSOP detection
- NSOP alarm data available for equipment and process improvement analysis
Stretch Goal:
- Correlate NSOP alarms with bond parameters (US power, force, time, pad condition)
- Implement trend-based or predictive warning before repeated NSOP occurs
- Reduce false alarm rate while maintaining high sensitivity for true NSOP events
Requirement:
- Electrical / Equipment Engineering (EE)
- Manufacturing Engineering
- Semiconductor / Mechanical / Mechatronics Engineering
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Top Skills
Electrical Engineering
Manufacturing Engineering
Mechanical Engineering
Mechatronics Engineering
Semiconductor Engineering
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