Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
In this role, you will have the opportunity to engage in all stages of a package design from architecture to feasibility studies to production. At the architectural stage, you will work with cross-functional teams to convey limitations and collect requirements. You will learn about the architectural aspects of our products very early. At the feasibility stage, you will work on fast iterations of different design concepts and will interact with stakeholders from silicon to system engineering. This is an opportunity to learn about all aspects of product design and market placement. At the production stage, you will work with design services and OSATs to drive the production design and DFM. This allows you to learn about manufacturing and production requirements.
This role is hybrid, based out of Taipei, Taiwan, Toronto, Canada or Austin, Texas.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Responsibilities:
- Drive routing feasibility studies on organic substrate and 2.5D interposers
- Evaluate silicon floorplan and IP bump map proposals and provide feedback
- Work with cross-functional teams and collect input to define package ball-out map
- Work closely with Power and Signal Integrity engineers to come up with optimized solutions
- Design daisy chain packages for testing and qualification
- Work with external design services to convert feasibility studies to production design and DFM
Experience & Qualifications:
- Minimum 5 years of experience as a package layout engineer (focusing on flip chip BGA packages) and "some" of the items below
- Proficient in Cadence Allegro
- Routing high-speed signals (GDDR, LPDDR, SERDES)
- Die-to-die protocols (BoW, UCIe, …)
- Design for high-power chips (300+ W)
- MCM and/or chiplet-based modules
- Advanced 2.5D and 3D packages (RDL/interposer) is an asset
- Familiar with packaging technology and manufacturing processes
- Ability to collaborate effectively with cross-functional teams
- Ability to provide design options based on incomplete or ambiguous data
- Ability to spin design quickly, automate the process, script, and do change control
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set by the U.S. government.
Our engineering positions and certain engineering support positions require access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and/or documentation will be required and considered as Tenstorrent moves through the employment process.
If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government. If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.
