Sr. Engineer, Mechanical Design

We are seeking a Senior Mechanical Design Engineer to lead the design and productization of mechanical and thermal solutions for high-performance PCIe Cards and multi-chip Server systems. This role requires a hands-on engineer who thrives in a fast-paced, cross-functional environment and can drive complex programs from concept to production.

This role is on-site, based out of Taipei, Taiwan. 

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Responsibilities:

• Design and validate advanced mechanical solutions for high-power AI computing systems, including PCIe Cards and multi-chip Server Systems.
• Conduct Finite Element Analysis (FEA) simulations to ensure mechanical reliability, including PCB microstrain validation.
• Manage complex BOMs and part lifecycles in a PLM system.
• Collaborate with PCB engineers to ensure compatibility between PCB layouts and mechanical enclosures, thermal systems, and other critical components.
• Oversee DFM (Design for Manufacturability) and DFA (Design for Assembly) efforts, working closely with suppliers to optimize part production and cost efficiency.
• Work with world-class suppliers, contractors, and test labs to ensure high-quality manufacturing and testing processes.
• Conduct product-level reliability testing, including vibration, shock, thermal cycling, and environmental testing, to validate design robustness.
• Generate detailed design documentation, including engineering drawings, test reports, and design guidelines, and provide training as needed.
• Lead design reviews and provide technical mentorship to junior engineers.

Experience & Qualifications:

• Bachelor’s or Master’s degree in Mechanical Engineering or equivalent.
• 5+ years of experience in mechanical design, preferably for high-performance electronics or AI computing systems.
• Expertise in enclosure design for electronics, including integration with thermal management solutions.
• Proficiency in CAD software (SolidWorks preferred), with experience in wire harness design and surfacing.
• Strong knowledge of various manufacturing processes, including injection molding, die-casting, extrusions, stamping, and 3D printing.
• Deep understanding of GD&T (Geometric Dimensioning and Tolerancing) and engineering drawing creation.
• Excellent problem-solving skills with a strong analytical mindset.
• Fluent in Mandarin and English for effective communication with local and international teams.
• Ability to travel internationally (up to 10% of the time) as required for supplier visits and critical design reviews.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set  by the U.S. government.

As this position will have direct and/or indirect access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and supporting documentation will be required and considered as a condition of employment.

If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government.  If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.