Teams at Microchip Technology Inc.

Lead development and execution of verification strategies for complex digital/mixed-signal designs using UVM/SVA. Collaborate with cross-functional teams, debug failures, define coverage metrics, mentor junior engineers, and drive verification tool and methodology improvements throughout the product lifecycle.

Oversee signal and power integrity for complex semiconductor package designs. Collaborate with PCB, mixed-signal, product development, and package teams; develop SI processes, simulations, models, and feasibility analyses; design and review PCB and package power systems; and support internal and external customers with signal integrity analysis.

Coordinates cross-functional semiconductor IP and SOC development activities across digital design, implementation, layout, DFT, mixed-signal, CAD, and flow-development teams. Plans and tracks deliverables, manages project risks, facilitates status meetings, aligns multi-location teams, presents project updates, incorporates customer feedback, and drives quality and customer satisfaction goals.